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GD32C113RBT6 Microcontroller Units GigaDevice Semiconductor
| Part Number: | GD32C113R8T6 GigaDevice Semiconductor | |
| Manufacturer: | GD GigaDevice Semiconductor | |
| Package: | LQFP64 | |
| Description: | ARM Cortex-M3 Max Speed:120MHz Flash:128KB SRAM:32KB I/O:up to 51 LQFP64 Microcontroller Units (MCUs/MPUs/SOCs) | |
| Packaging: | 160pcs/tray (The products will be packed into a suitable carton.) | |
| Price(USD): | Detailed Inquiry | |
| In Stock: | 160pcs (If demand exceeds stock, the products will be ready within 2 days) | |
| Download GD32C113R8T6 Datasheet | Related Posts | |
| Environmental Information | The product complies with RoHS requirements. Risunsemi provides relevant certificates according to your needs. |
| Shipping | All parts are estimated to ship out within 2 working days after the payment is confirmed. (We will inform you If components need to be ordered). DHL, UPS, FedEx, EMS, Air shipping, Sea shipping, or other ways can ship the products. Estimated shipping time depends on the carriers. |
| Payment | Risunsemi defaults EXW terms for all quotations. If you need other terms, please contact customer service. Orders below USD 10,000 need to pay 100% in advance by T/T. Orders over USD 10,000 need to pay 50% by T/T as a deposit to arrange the goods, and the rest 50% payment before delivery. For Sample orders, we support PayPal, Western Union, UnionPay, Alipay, and Credit cards, including Visa, Master, and American Express. |
| Returning | Returns are accepted when completed within 30 days from the date of shipment. Please get in touch with us for a return authorization. Parts should be unused and in original packaging (MCUs/CPLDs/DSPs cannot be returned). The customer has to take charge of the return shipping. |
| Warranty | All customers come with a 90-day warranty against any manufacturing defects. This warranty shall not apply to any item where defects have been caused by improper customer assembly, failure by the customer to follow instructions, product modification, negligent or improper operation. |
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Quality is NOT to be Negotiated!
RisunSemi is most concerned about the quality of the electronic components we sell.
In addition to strictly controlling supply channels and obtaining original shipment documents from suppliers, RisunSemi also needs to do as follow:
1 According to the testing standards, RisunSemi judges whether the packaging and printing of components are correct and whether the pins are tinned and oxidized. Visual inspection allows us to rule out counterfeit refurbishment, sanding and recoating.
2 X-ray testing is a real-time non-destructive analysis to check the internal conditions of components, mainly to check chip lead frame, wafer size, and gold wire bonding pattern. RisunSemi conducts X-ray sampling inspection on parts to ensure the packaging process.
3 The function test is to design a particular test circuit according to the datasheet, input the signal source to the sample, and analyze the signal’s logical relationship and the waveform’s changing state to detect the component’s functional characteristics.
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